| Product |
Applications |
Features |
| 9001-E-v3.0 |
Thin coating, wicking and underfill |
Low viscosity; can be cured in shadow areas at 120°C |
| 9001-E-v3.1 |
Glob top |
Medium viscosity; can be cured in shadow areas at 120°C |
| 9001-E-v3.5 |
Precision application to specific electronic assembly areas |
High viscosity; can be cured in shadow areas at 120°C |
| 9001-E-v3.7 |
Precision application to specific electronic assembly areas |
Highest viscosity; can be cured in shadow areas at 120°C |
| 9008 |
Encapsulating on Flex/Polyimide |
High adhesion to polyimide to –40°C; flexible |
| 9-20558 |
Strain relief or chip encapsulation |
Flexible; moisture barrier for metal, ceramic, epoxy and glass filled plastics |
