Achieve increased productivity over epoxies, silicones and hot melts with easy to use, low cost adhesives.
| Product Selector Guide |
|
| Product |
Applications |
Features |
| Electronics adhesives |
| DYM 9-20558 |
Bonding Kapton™ polyimide to pcb; strain relief |
Flexible; moisture barrier for metal, ceramic, epoxy and glass filled plastics |
| DYM 910 |
Wire and parts tacking; strain relief; unitising |
Flexible; good adhesion; mechanically removable |
| DYM 912-A |
Wire tacking |
Fast curing; withstands wave soldering whilst resisting most solvent and aqueous cleaning processes |
| DYM 914-A |
Wire tacking on pcb's; for manual and fully automated dispensing systems |
Good insulation qualities; shock absorbing; deep cure capability; bonds well to porous surfaces; rapid cure speed |
| DYM 921-Gel |
Ruggedising heavy components |
Rapid curing; high strength; hard, clear bonds |
| Thermal management adhesives |
| DYM 9-20689 |
Adhesive paste; for parts subject to disassembly |
Repairable with application of heat; cures with heat or activator |
| DYM 9-20691 |
Mounting heat sinks |
Medium strength; for extreme temperature ranges |
| DYM 9-20696 |
Adhesive paste; cures with UV light or heat or activator |
High thermal conductivity for dissipating heat in high power assemblies |
| DYM 9-20699 |
For parts subject to disassembly |
Self shimming; for maintaining specific gap size |
| DYM 991-Rev A |
Mounting heat sinks and heat sensitive components |
High strength for permanent assemblies; UV, activator or heat curing |
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